CEI EN 60191-6-3 PDF

Name:
CEI EN 60191-6-3 PDF

Published Date:
05/01/2001

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Norma recepita mediante l'annuncio su CEINFORMA maggio 2001.

Edition :	01
File Size :	1 file , 200 KB
Number of Pages :	24
Published :	05/01/2001

History

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