CEI EN 60191-6-4 PDF

CEI EN 60191-6-4 PDF

Name:
CEI EN 60191-6-4 PDF

Published Date:
02/01/2004

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
cei-en-60191-6-4_2749918

Choose Document Language:
15.00 €
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Norma recepita mediante l'annuncio su CEINFORMA febbraio 2004.


Edition : 04
File Size : 1 file , 230 KB
Number of Pages : 24
Published : 02/01/2004

History


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