CEI EN 60191-6-4 PDF

Name:
CEI EN 60191-6-4 PDF

Published Date:
02/01/2004

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Norma recepita mediante l'annuncio su CEINFORMA febbraio 2004.

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