CEI EN 60191-6-5 PDF

CEI EN 60191-6-5 PDF

Name:
CEI EN 60191-6-5 PDF

Published Date:
02/01/2002

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$10.5
Need Help?

Norma recepita mediante l'annuncio su CEINFORMA febbraio 2002.


Edition : 02
File Size : 1 file , 180 KB
Number of Pages : 18
Published : 02/01/2002

History


Related products

CEI UNEL 35023
Published Date: 05/01/2020
Cavi di energia per tensione nominale U uguale a 1 kV - Cadute di tensione
$5.4
CEI EN 50380
Published Date: 04/01/2018
Marking and documentation requirements for Photovoltaic Modules
$13.5
CEI UNI EN ISO/IEC 8183
Published Date: 09/01/2024
Information technology - Artificial intelligence - Data life cycle framework
$13.5

Best-Selling Products

APA 3D-001
Published Date: 11/01/2006
APA Full-Scale House Test Project: Progress Report 1
APA 3D-002
Published Date: 01/01/2007
APA Full-Scale House Test Project: Progress Report 2
APA 3D-003
Published Date: 01/01/2007
APA Full-Scale House Test Project: Progress Report 3
APA 3D-004
Published Date: 01/01/2007
APA Full-Scale House Test Project: Progress Report 4
APA 3D-005
Published Date: 01/01/2007
APA Full-Scale House Test Project: Progress Report 5
APA 3D-007
Published Date: 01/01/2007
APA Full-Scale House Test Project: Progress Report 7