CEI EN 61189-3-719 PDF

CEI EN 61189-3-719 PDF

Name:
CEI EN 61189-3-719 PDF

Published Date:
11/01/2016

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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BILINGUAL

This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.


Edition : 16
File Size : 1 file , 640 KB
Number of Pages : 20
Published : 11/01/2016

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