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CEI EN 61189-5-3 PDF

CEI EN 61189-5-3 PDF

Name:
CEI EN 61189-5-3 PDF

Published Date:
05/01/2016

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$19.5
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This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.


Edition : 16
File Size : 1 file , 2.6 MB
Number of Pages : 48
Published : 05/01/2016

History

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