Name:
CEI EN 61190-1-2 PDF
Published Date:
04/01/2015
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.
| Edition : | 15 |
| File Size : | 1 file , 540 KB |
| Number of Pages : | 30 |
| Published : | 04/01/2015 |
