CEI EN 61190-1-3 PDF

Name:
CEI EN 61190-1-3 PDF

Published Date:
04/01/2008

Status:
[ Revised ]

Description:

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Edition :	08
File Size :	2 files , 690 KB
Number of Pages :	98
Published :	04/01/2008

History

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CEI EN 61190-1-3 PDF

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

History

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