Name:
CEI EN 61191-4 PDF
Published Date:
02/01/2018
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
| Edition : | 18 |
| File Size : | 1 file , 2.3 MB |
| Number of Pages : | 28 |
| Published : | 02/01/2018 |