CEI EN 61760-3 PDF

CEI EN 61760-3 PDF

Name:
CEI EN 61760-3 PDF

Published Date:
11/01/2010

Status:
[ Revised ]

Description:

Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
cei-en-61760-3_2726279

Choose Document Language:
26.70 €
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BILINGUAL * W/D S/S BY CEI EN IEC 61760-3

La presente Norma fa parte della serie EN/IEC 61760 riguardante la tecnologia di montaggio superficiale ed in particolare questa parte si occupa dei componenti per la saldatura a rifusione a fori passanti (THR).
La Norma fornisce un insieme di requisiti, condizioni di processo e delle prove associate da adottare nella stesura delle specifiche per i componenti elettronici che devono essere usati nei processi di saldatura a riflusso a fori passanti.
Obiettivo della Norma è quello di assicurare che i componenti dotati di terminali e destinati al montaggio superficiale e a quello a fori passanti possano essere usati negli stessi processi di posa e montaggio.
La norma infine fornisce agli utilizzatori e ai produttori dei componenti un insieme di tipiche condizioni di processo da usare per la saldatura a fori passanti con riflusso.
ATTENZIONE: La Norma contiene immagini e testo che, per una migliore lettura del contenuto, richiedono la stampa a colori.


Edition : 10
File Size : 1 file , 420 KB
Number of Pages : 48
Published : 11/01/2010

History

CEI EN IEC 61760-3
Published Date: 10/01/2021
Surface mounting technology Part 3: Standard method for the specification of components for throughhole reflow (THR) soldering
21.30 €
CEI EN 61760-3
Published Date: 11/01/2010
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
26.70 €

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