CEI EN 62047-15 PDF

CEI EN 62047-15 PDF

Name:
CEI EN 62047-15 PDF

Published Date:
01/01/2016

Status:
[ Active ]

Description:

Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
cei-en-62047-15_2757543

Choose Document Language:
6.90 €
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This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip


Edition : 16
File Size : 1 file , 420 KB
Number of Pages : 18
Published : 01/01/2016

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