CEI EN 62047-9 PDF

Name:
CEI EN 62047-9 PDF

Published Date:
07/01/2012

Status:
[ Active ]

Description:

Semiconductor devices - Micro-electromechanical devices Part 9: Wafer to wafer bonding strength measurement for MEMS

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 μm to several millimeters.

Edition :	12
File Size :	1 file , 1.2 MB
Number of Pages :	32
Published :	07/01/2012

History

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