CEI EN 62137-3 PDF

Name:
CEI EN 62137-3 PDF

Published Date:
08/01/2012

Status:
[ Active ]

Description:

Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

BILINGUAL

This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.

Edition :	12
File Size :	1 file , 1 MB
Number of Pages :	90
Published :	08/01/2012

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