Name:
CEI EN 62374-1 PDF
Published Date:
05/01/2012
Status:
[ Active ]
Publisher:
Comitato Elettrotecnico Italiano
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
| Edition : | 12 |
| File Size : | 1 file , 920 KB |
| Number of Pages : | 24 |
| Published : | 05/01/2012 |