CEI EN 62878-1-1 PDF

CEI EN 62878-1-1 PDF

Name:
CEI EN 62878-1-1 PDF

Published Date:
02/01/2016

Status:
[ Revised ]

Description:

Device embedded substrate Part 1-1: Generic specification - Test methods

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$25.5
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This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.


Edition : 16
File Size : 1 file , 2.3 MB
Number of Pages : 62
Published : 02/01/2016

History

CEI EN IEC 62878-1
Published Date: 05/01/2020
Device embedding assembly technology Part 1: Generic specification for device embedded substrates
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CEI EN 62878-1-1
Published Date: 02/01/2016
Device embedded substrate Part 1-1: Generic specification - Test methods
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