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CEI EN IEC 60749-10 PDF

CEI EN IEC 60749-10 PDF

Name:
CEI EN IEC 60749-10 PDF

Published Date:
12/01/2022

Status:
[ Active ]

Description:

Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
cei-en-iec-60749-10_2748622
Choose Document Language:
11.40 €
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ENGLISH

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.


Edition : 22#
File Size : 1 file , 2.1 MB
Number of Pages : 20
Published : 12/01/2022

History

CEI EN IEC 60749-10
CEI EN IEC 60749-10
Published Date: 12/01/2022
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
11.40 €
CEI EN 60749-10
CEI EN 60749-10
Published Date: 03/01/2004
Semiconductor devices - Mechanical and climatic test method - Part 10: Mechanical shock
4.50 €

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