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CEI EN IEC 60749-20 PDF

CEI EN IEC 60749-20 PDF

Name:
CEI EN IEC 60749-20 PDF

Published Date:
12/01/2020

Status:
[ Active ]

Description:

Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$21.3
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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.


Edition : 20
File Size : 1 file , 2.1 MB
Number of Pages : 36
Published : 12/01/2020

History

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