CEI EN IEC 60749-20 PDF

Name:
CEI EN IEC 60749-20 PDF

Published Date:
12/01/2020

Status:
[ Active ]

Description:

Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Edition :	20
File Size :	1 file , 2.1 MB
Number of Pages :	36
Published :	12/01/2020

History

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