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CEI EN IEC 61188-6-1 PDF

CEI EN IEC 61188-6-1 PDF

Name:
CEI EN IEC 61188-6-1 PDF

Published Date:
11/01/2021

Status:
[ Active ]

Description:

Circuit boards and circuit board assemblies - Design and use Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$23.7
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ENGLISH

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.


Edition : 21
File Size : 1 file , 6.6 MB
Number of Pages : 40
Published : 11/01/2021

History

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