CEI EN IEC 61188-6-2 PDF

Name:
CEI EN IEC 61188-6-2 PDF

Published Date:
11/01/2021

Status:
[ Active ]

Description:

Circuit boards and circuit board assemblies - Design and use Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

ENGLISH

This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.

Edition :	21
File Size :	1 file , 2.9 MB
Number of Pages :	34
Published :	11/01/2021

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