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CEI EN IEC 61189-2-501 PDF

CEI EN IEC 61189-2-501 PDF

Name:
CEI EN IEC 61189-2-501 PDF

Published Date:
10/01/2022

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
cei-en-iec-61189-2-501_2748615
Choose Document Language:
13.50 €
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ENGLISH

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.


Edition : 22#
File Size : 1 file , 2.5 MB
Number of Pages : 24
Published : 10/01/2022

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