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CEI EN IEC 61189-2-804 PDF

CEI EN IEC 61189-2-804 PDF

Name:
CEI EN IEC 61189-2-804 PDF

Published Date:
01/01/2024

Status:
[ Active ]

Description:

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$9.6
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ENGLISH

This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.


Edition : 24#
File Size : 1 file , 1.5 MB
Number of Pages : 18
Published : 01/01/2024

History

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