CEI EN IEC 61189-2-807 PDF

Name:
CEI EN IEC 61189-2-807 PDF

Published Date:
06/01/2022

Status:
[ Active ]

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

ENGLISH

This part of IEC 61189 specifies a test method to determine the decomposition temperature (T_d) of base laminate materials using thermogravimetric analysis (TGA).

Edition :	22
File Size :	1 file , 2.3 MB
Number of Pages :	18
Published :	06/01/2022

History

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