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CEI EN IEC 61189-2-808 PDF

CEI EN IEC 61189-2-808 PDF

Name:
CEI EN IEC 61189-2-808 PDF

Published Date:
07/01/2024

Status:
[ Active ]

Description:

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$16.8
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ENGLISH

This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.

NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.


Edition : 24#
File Size : 1 file , 2.7 MB
Number of Pages : 30
Published : 07/01/2024

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