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CEI EN IEC 61190-1-3 PDF

CEI EN IEC 61190-1-3 PDF

Name:
CEI EN IEC 61190-1-3 PDF

Published Date:
06/01/2018

Status:
[ Active ]

Description:

Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$29.1
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This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.


Edition : 18
File Size : 1 file , 2.8 MB
Number of Pages : 52
Published : 06/01/2018

History

CEI EN IEC 61190-1-3
CEI EN IEC 61190-1-3
Published Date: 06/01/2018
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
$29.1
CEI EN 61190-1-3
CEI EN 61190-1-3
Published Date: 04/01/2008
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$33.3

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