CEI UNI EN 16602-70-61 PDF

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole, solderless assemblies and soldering of harness and wire interconnection.

The Standard defines workmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand ground testing conditions including LTS (long term storage) and the environment imposed by space flight and launchers.

The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission within the temperature limits of -55 °C to +85 °C at solder joint level.

Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 and ECSS-Q-ST-70-12.

This standard does not cover lead-free soldering and associated requirements.

This Standard does not cover the qualification and acceptance of the EQM and FM equipment with high-reliability electronic circuits of surface mount, through hole and solderless assemblies.

This Standard does not cover verification of thermal properties for component assembly.

This Standard does not cover pressfit connectors due to the possible damage in the PCB that is not evaluated within this test requirement.

The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03.

This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00.