Twenty-Seventh International Congress on Large Dams PDF

Twenty-Seventh International Congress on Large Dams PDF

Name:
Twenty-Seventh International Congress on Large Dams PDF

Published Date:
01/01/2022

Status:
[ Active ]

Description:

Publisher:
CRC Press Books

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$206.4
Need Help?
ENGLISH/FRENCH * ISBN: 9781000729368

The International Committee on Large Dams (ICOLD) held its 27th International Congress in Marseille, France (12-19 November 2021). The proceedings of the congress focus on four main questions: 1. Reservoir sedimentation and sustainable development; 2. Safety and risk analysis; 3. Geology and dams, and 4. Small dams and levees. The book thoroughly discusses these questions and is indispensable for academics, engineers and professionals involved or interested in engineering, hydraulic engineering and related disciplines.

Author:ICOLD CIGB


Edition : 1
Number of Pages : 3622
Published : 01/01/2022
isbn : ish/french * is

History


Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1