DANSK DS/CEN/CLC/TR 17603-31-14 PDF

In this Part 14 cooling methods below 100 K are described. These low temperature levels are mainly required by space borne electronic systems operating under very low noise conditions. Details on the materials used and safety factors are given. The Thermal design handbook is published in 16 Parts TR 17603-31-01 Part 1 Thermal design handbook – Part 1: View factors TR 17603-31-01 Part 2 Thermal design handbook – Part 2: Holes, Grooves and Cavities TR 17603-31-01 Part 3 Thermal design handbook – Part 3: Spacecraft Surface Temperature TR 17603-31-01 Part 4 Thermal design handbook – Part 4: Conductive Heat Transfer TR 17603-31-01 Part 5 Thermal design handbook – Part 5: Structural Materials: Metallic and Composite TR 17603-31-01 Part 6 Thermal design handbook – Part 6: Thermal Control Surfaces TR 17603-31-01 Part 7 Thermal design handbook – Part 7: Insulations TR 17603-31-01 Part 8 Thermal design handbook – Part 8: Heat Pipes TR 17603-31-01 Part 9 Thermal design handbook – Part 9: Radiators TR 17603-31-01 Part 10 Thermal design handbook – Part 10: Phase – Change Capacitors TR 17603-31-01 Part 11 Thermal design handbook – Part 11: Electrical Heating TR 17603-31-01 Part 12 Thermal design handbook – Part 12: Louvers TR 17603-31-01 Part 13 Thermal design handbook – Part 13: Fluid Loops TR 17603-31-01 Part 14 Thermal design handbook – Part 14: Cryogenic Cooling TR 17603-31-01 Part 15 Thermal design handbook – Part 15: Existing Satellites TR 17603-31-01 Part 16 Thermal design handbook – Part 16: Thermal Protection System