DANSK DS/EN 2667-3 PDF

DANSK DS/EN 2667-3 PDF

Name:
DANSK DS/EN 2667-3 PDF

Published Date:
09/09/2019

Status:
[ Active ]

Description:

Aerospace series – Non-metallic materials – Foaming structural adhesive films – Test methods – Part 3: Expansion ratio and volatile content

Publisher:
Dansk Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$11.4
Need Help?

This document specifies the test method for determining the expansion ratio and the volatile content in structural foaming adhesive films.


Edition : 19
File Size : 1 file , 1.7 MB
Number of Pages : 9
Product Code(s) : DS-009, DS-009
Published : 09/09/2019

History


Related products

DANSK DS/EN 12280-1
Published Date: 04/01/1998
Rubber- or plastics-coated fabrics - Accelerated ageing tests - Part 1: Heat ageing
$11.4
DANSK DS/CEN/TS 15568
Published Date: 03/12/2007
Foodstuffs - Methods of analysis for the detection of genetically modified organisms and derived products - Sampling strategies
$15.3
DANSK DS/IEC/TS 62056-6-9
Published Date: 05/13/2016
Electricity metering data exchange – The DLMS/COSEM suite – Part 6-9: Mapping between the Common Information Model message profiles (IEC 61968-9) and DLMS/COSEM (IEC 62056) data models and protocols
$30
DANSK DS/EN 14333-1
Published Date: 11/22/2004
Non fatty foods - Determination of benzimidazole fungicides carbendazim, thiabendazole and benomyl (as carbendazim) - Part 1: HPLC method with solid phase extraction clean-up
$13.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1