DANSK DS/EN 60191-6-18 PDF

Name:
DANSK DS/EN 60191-6-18 PDF

Published Date:
04/09/2010

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

SAME AS IEC 60191-6-18

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Edition :	10
File Size :	1 file , 1.6 MB
Number of Pages :	26
Product Code(s) :	DS-026, DS-026
Published :	04/09/2010

History

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DANSK DS/EN 60191-6-18 PDF

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

History

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