Name:
DANSK DS/EN 60191-6-19 PDF
Published Date:
06/14/2010
Status:
[ Active ]
Publisher:
Dansk Standard
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
| Edition : | 10 |
| File Size : | 1 file , 1.1 MB |
| Number of Pages : | 22 |
| Product Code(s) : | DS-021, DS-021 |
| Published : | 06/14/2010 |