DANSK DS/EN 60191-6-19 PDF

DANSK DS/EN 60191-6-19 PDF

Name:
DANSK DS/EN 60191-6-19 PDF

Published Date:
06/14/2010

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Publisher:
Dansk Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$18
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SAME AS IEC 60191-6-19

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.


Edition : 10
File Size : 1 file , 1.1 MB
Number of Pages : 22
Product Code(s) : DS-021, DS-021
Published : 06/14/2010

History


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