DANSK DS/EN 60191-6-21 PDF

Name:
DANSK DS/EN 60191-6-21 PDF

Published Date:
11/22/2010

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

SAME AS IEC 60191-6-21

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Edition :	10
File Size :	1 file , 970 KB
Number of Pages :	22
Product Code(s) :	DS-021, DS-021
Published :	11/22/2010

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