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DANSK DS/EN 60191-6-22 PDF

DANSK DS/EN 60191-6-22 PDF

Name:
DANSK DS/EN 60191-6-22 PDF

Published Date:
04/09/2013

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$18
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SAME AS IEC 60191-6-22

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).


Edition : 13
File Size : 1 file , 1.5 MB
Number of Pages : 22
Product Code(s) : DS-021, DS-021
Published : 04/09/2013

History

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