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DANSK DS/EN 60191-6-2 PDF

DANSK DS/EN 60191-6-2 PDF

Name:
DANSK DS/EN 60191-6-2 PDF

Published Date:
07/09/2002

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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This part of IEC 60191 covers the requirements for the preparation of drawings of intergrated circuit outlines for the various ball terminal packages, i.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, i.g. ceramic column grid array (C-CGA).


Edition : 02
File Size : 1 file , 210 KB
Number of Pages : 18
Product Code(s) : DS-017, DS-017
Published : 07/09/2002

History

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