DANSK DS/EN 60191-6-4 PDF

DANSK DS/EN 60191-6-4 PDF

Name:
DANSK DS/EN 60191-6-4 PDF

Published Date:
01/05/2004

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Publisher:
Dansk Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
dansk-ds-en-60191-6-4_2683422

Choose Document Language:
18.00 €
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SAME AS IEC 60191-6-4

This part of IEC 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.


Edition : 04
File Size : 1 file , 280 KB
Number of Pages : 22
Product Code(s) : DS-021, DS-021
Published : 01/05/2004

History


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