DANSK DS/EN 60191-6-4 PDF

Name:
DANSK DS/EN 60191-6-4 PDF

Published Date:
01/05/2004

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

SAME AS IEC 60191-6-4

This part of IEC 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Edition :	04
File Size :	1 file , 280 KB
Number of Pages :	22
Product Code(s) :	DS-021, DS-021
Published :	01/05/2004

History

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DANSK DS/EN 60191-6-4 PDF

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

History

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