DANSK DS/EN 60191-6-5 PDF

DANSK DS/EN 60191-6-5 PDF

Name:
DANSK DS/EN 60191-6-5 PDF

Published Date:
04/08/2002

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Publisher:
Dansk Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$15.3
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SAME AS IEC 60191-6-5

This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.


Edition : 02
File Size : 1 file , 590 KB
Number of Pages : 18
Product Code(s) : DS-017, DS-017
Published : 04/08/2002

History


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