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DANSK DS/EN 60749-15 PDF

DANSK DS/EN 60749-15 PDF

Name:
DANSK DS/EN 60749-15 PDF

Published Date:
01/26/2011

Status:
[ Withdrawn ]

Description:

Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$15.3
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IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: – editorial change in the scope; – addition of lead-free solder chemical composition specification.


Edition : 11
File Size : 1 file , 930 KB
Number of Pages : 18
Product Code(s) : DS-017, DS-017
Published : 01/26/2011

History

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