DANSK DS/EN 60749-22+CORR.1 PDF

Name:
DANSK DS/EN 60749-22+CORR.1 PDF

Published Date:
01/05/2004

Status:
[ Active ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght

Publisher:
Dansk Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this part is to measures bond strength or determine compliance with specified bond strength requirements.

Edition :	03
File Size :	1 file , 240 KB
Number of Pages :	26
Product Code(s) :	DS-026, DS-026
Published :	01/05/2004

History

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