Name:
DANSK DS/EN 60749-25 PDF
Published Date:
01/05/2004
Status:
[ Active ]
Publisher:
Dansk Standard
This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
| Edition : | 04 |
| File Size : | 1 file , 140 KB |
| Number of Pages : | 19 |
| Product Code(s) : | DS-017, DS-017 |
| Published : | 01/05/2004 |
