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DANSK DS/EN 61191-3 PDF

DANSK DS/EN 61191-3 PDF

Name:
DANSK DS/EN 61191-3 PDF

Published Date:
09/04/2017

Status:
[ Active ]

Description:

Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$19.2
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SAME AS IEC 61191-3

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.


Edition : 17
File Size : 1 file , 1.7 MB
Number of Pages : 26
Product Code(s) : DS-026, DS-026
Published : 09/04/2017

History

DANSK DS/EN 61191-3
DANSK DS/EN 61191-3
Published Date: 09/04/2017
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
$19.2
DANSK DS/EN 61191-3
DANSK DS/EN 61191-3
Published Date: 09/10/1999
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
$8.4

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