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DANSK DS/EN 61192-1 PDF

DANSK DS/EN 61192-1 PDF

Name:
DANSK DS/EN 61192-1 PDF

Published Date:
05/23/2003

Status:
[ Withdrawn ]

Description:

Workmanship requirements for soldered electronic assemblies – Part 1: General

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$35.7
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SAME AS IEC 61192-1 * W/D NO S/S

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon.


Edition : 03
File Size : 1 file , 920 KB
Number of Pages : 82
Product Code(s) : DS-081, DS-081
Published : 05/23/2003

History

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