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DANSK DS/EN 61192-2 PDF

DANSK DS/EN 61192-2 PDF

Name:
DANSK DS/EN 61192-2 PDF

Published Date:
06/06/2003

Status:
[ Withdrawn ]

Description:

Workmanship requirements for soldered electronic assemblies – Part 2: Surface-mount assemblies

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
dansk-ds-en-61192-2_2696207
Choose Document Language:
33.00 €
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SAME AS IEC 61192-2 * W/D NO S/S

This part of IEC 61192 specifies requirments for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of organic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or into a ceramic-coated metal substrate.


Edition : 03
File Size : 1 file , 25 MB
Number of Pages : 70
Product Code(s) : DS-061, DS-061
Published : 06/06/2003

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