Name:
DANSK DS/EN 61192-3 PDF
Published Date:
05/23/2003
Status:
[ Withdrawn ]
Publisher:
Dansk Standard
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally trough-hole or mixed assemblies that include surface-mounting or other related assembliy technologies, for example, terminals, wires.
| Edition : | 03 |
| File Size : | 1 file , 5.6 MB |
| Number of Pages : | 54 |
| Product Code(s) : | DS-051, DS-051 |
| Published : | 05/23/2003 |