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DANSK DS/EN 62047-9 PDF

DANSK DS/EN 62047-9 PDF

Name:
DANSK DS/EN 62047-9 PDF

Published Date:
10/03/2011

Status:
[ Active ]

Description:

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$22.5
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SAME AS IEC 62047-9

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ìm to several millimeters.


Edition : 11
File Size : 1 file , 1.6 MB
Number of Pages : 34
Product Code(s) : DS-031, DS-031
Published : 10/03/2011

History

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