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DANSK DS/EN 62137-1-3 PDF

DANSK DS/EN 62137-1-3 PDF

Name:
DANSK DS/EN 62137-1-3 PDF

Published Date:
03/11/2009

Status:
[ Active ]

Description:

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$19.2
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SAME AS IEC 62137-1-3

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.


Edition : 09
File Size : 1 file , 2.3 MB
Number of Pages : 30
Product Code(s) : DS-017, DS-017
Published : 03/11/2009

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