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DANSK DS/EN IEC 61190-1-3 PDF

DANSK DS/EN IEC 61190-1-3 PDF

Name:
DANSK DS/EN IEC 61190-1-3 PDF

Published Date:
03/13/2018

Status:
[ Active ]

Description:

Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$27
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IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.


Edition : 18
File Size : 1 file , 3 MB
Number of Pages : 49
Product Code(s) : DS-041, DS-041
Published : 03/13/2018

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