DANSK DSF/FPREN IEC 62047-35 PDF

This part of 62047 specifies the test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices, where foldable device still functions while the device is even folded in half. These devices include passive micro components and (or) active micro components on the flexible film or imbedded in the flexible film. The desired in-plane dimension of the device for the test method ranges typically from 1mm to 300mm and the thickness ranges from 10µm to 1mm, but not limited to. The test method is so designed as to bent devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded in half, so that the entire degradation behaviour of electric property under bending deformation is obtained. Th is part is essential to estimate the safety margin under certain bending deformation and indispensable for reliable design of the product employing these devices.