DANSK DSF/FPREN IEC 62435-9 PDF

This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor device building blocks of all types are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity. Local environments for long term storage can be unique to the application or to the type of subassembly being stored for further assembly. Different device types that are integrated into a single package or module can have different storage requirements that should be considered during long term storage. A product can contain a single die or multiple dice (example: a CMOS processor, a GaN radio, sensors and a new type of memory). Each device technology can impose storage requirements. For example: the memory can need to be removed from x- ray or high magnetic field sources and the sensors can be storage in a dark environment or low-pressure environment. Such practice requires good communication interactions and agreements for storage that should account for the possibility and complexity of intermediate assembly of heterogeneous devices. Successful customer supplier interaction involves clear expectations for device provenance, traceability and identification. NOTE – In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and packaged devices.