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DANSK DSF/FPREN IEC 62878-1 PDF

DANSK DSF/FPREN IEC 62878-1 PDF

Name:
DANSK DSF/FPREN IEC 62878-1 PDF

Published Date:

Status:
[ Draft ]

Description:

Device embedding assembly technology – Part 1: Generic specification for device embedded substrates

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$12
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DRAFT

This part of IEC 62878 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components. The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.


Edition : 19
File Size : 1 file , 1.1 MB
Number of Pages : 21
Product Code(s) : DSF-021, DSF-021

History

DANSK DSF/FPREN IEC 62878-1
DANSK DSF/FPREN IEC 62878-1
Published Date:
Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
$12
DANSK DSF/PREN IEC 62878-1
DANSK DSF/PREN IEC 62878-1
Published Date:
Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
$8.7
DANSK DS/EN IEC 62878-1
DANSK DS/EN IEC 62878-1
Published Date: 12/10/2019
Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
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