DANSK DSF/FPREN IEC 63215-2 PDF

This International Standard applies to the die attach materials and joining system applied to discrete type power electronic devices. This International Standard specifies temperature cycling test method which is taking into account of actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes classification level for joining reliability (reliability performance index). The test method specified in this standard is not intended to evaluate power semiconductor devices themselves. The test method specified in this standard is not regarded as the one to be used to guarantee the reliability of the power semiconductor device packages.