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DANSK DSF/PREN 63011-2 PDF

DANSK DSF/PREN 63011-2 PDF

Name:
DANSK DSF/PREN 63011-2 PDF

Published Date:

Status:
[ Draft ]

Description:

Integrated circuits – Three dimensional integrated circuits – Part 2: Alignment of stacked dies having fine pitch interconnect

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$13.2
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DRAFT

This technical information is to provide specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications shall be applied only if electrical coupling method of die-to-die alignment is used in the die stacking.


Edition : 17
File Size : 1 file , 1 MB
Number of Pages : 14
Product Code(s) : DSF-009, DSF-009

History

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