Name:
DANSK DSF/PREN 63011-2 PDF
Published Date:
Status:
[ Draft ]
Publisher:
Dansk Standard
This technical information is to provide specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications shall be applied only if electrical coupling method of die-to-die alignment is used in the die stacking.
| Edition : | 17 |
| File Size : | 1 file , 1 MB |
| Number of Pages : | 14 |
| Product Code(s) : | DSF-009, DSF-009 |
