Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. DANSK
  3. DANSK DSF/PREN IEC 60749-10 PDF

DANSK DSF/PREN IEC 60749-10 PDF

DANSK DSF/PREN IEC 60749-10 PDF

Name:
DANSK DSF/PREN IEC 60749-10 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$8.7
Need Help?
DRAFT * W/D S/S BY DS/EN IEC 60749-10

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.


Edition : 21
File Size : 1 file , 970 KB
Number of Pages : 14
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/PREN IEC 60749-10
DANSK DSF/PREN IEC 60749-10
Published Date:
Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly
$8.7
DANSK DS/EN IEC 60749-10
DANSK DS/EN IEC 60749-10
Published Date: 06/16/2022
Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly
$15.3

Related products

DANSK DS/EN ISO 787-17
DANSK DS/EN ISO 787-17
Published Date: 05/21/2019
General methods of test for pigments and extenders – Part 17: Comparison of lightening power of white pigments (ISO 787-17:2019)
$13.2
DANSK DS/EN IEC 61300-3-4
DANSK DS/EN IEC 61300-3-4
Published Date: 06/19/2023
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 3-4: Examinations and measurements – Attenuation
$22.5
DANSK DS/EN 60674-3-4 TIL 6
DANSK DS/EN 60674-3-4 TIL 6
Published Date: 12/07/1995
Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheets 4 to 6: Requirements for polyimide films used for electrical insulation
$23.4
DANSK DS/EN IEC 61967-1
DANSK DS/EN IEC 61967-1
Published Date: 02/18/2019
Integrated circuits – Measurement of electromagnetic emissions – Part 1: General conditions and definitions
$22.5

Best-Selling Products

TELCORDIA FR-RTP-1-CD-21-100USERS
TELCORDIA FR-RTP-1-CD-21-100USERS
Published Date: 02/01/2003
Release to Pivot (RTP) Family of Requirements (RTPFR), FR-RTP-1
TELCORDIA FR-SONET-17-CD-1USER
TELCORDIA FR-SONET-17-CD-1USER
Published Date: 02/01/2003
Broadband and Transport Network Generic Requirements: SONET and ATM Transport Technologies
TELCORDIA FR-SONET-17-CD-6-20USER
TELCORDIA FR-SONET-17-CD-6-20USER
Published Date: 02/01/2003
Broadband and Transport Network Generic Requirements: SONET and ATM Transport Technologies
TELCORDIA GR-1009
TELCORDIA GR-1009
Published Date: 11/01/1994
Generic Requirements for Fiber Optic Clip-on Test Sets
TELCORDIA GR-1031
TELCORDIA GR-1031
Published Date: 10/01/1997
OTGR Section 15.6: Operations Interfaces Using OSI Tools: Test Access Management
TELCORDIA GR-1042
TELCORDIA GR-1042
Published Date: 12/01/1998
Generic Requirements for Operations Interfaces Using OSI Tools - Information Model Overview: Synchronous Optical Network (SONET) Transport Information Model