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DANSK DSF/PREN IEC 60749-10 PDF

DANSK DSF/PREN IEC 60749-10 PDF

Name:
DANSK DSF/PREN IEC 60749-10 PDF

Published Date:

Status:
[ Draft-Obsolete ]

Description:

Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly

Publisher:
Dansk Standard

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
dansk-dsf-pren-iec-60749-10_2686995
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8.70 €
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DRAFT * W/D S/S BY DS/EN IEC 60749-10

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.


Edition : 21
File Size : 1 file , 970 KB
Number of Pages : 14
Product Code(s) : DSF-009, DSF-009

History

DANSK DSF/PREN IEC 60749-10
DANSK DSF/PREN IEC 60749-10
Published Date:
Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly
8.70 €
DANSK DS/EN IEC 60749-10
DANSK DS/EN IEC 60749-10
Published Date: 06/16/2022
Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly
15.30 €

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